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Polytype None Permitted SiC Epitaxial Wafer P-MOS P-SBD D Grade

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Polytype None Permitted SiC Epitaxial Wafer P-MOS P-SBD D Grade

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Brand Name :GaNova
Model Number :JDCD03-001-004
Certification :UKAS/ISO9001:2015
Place of Origin :Suzhou China
Payment Terms :T/T
Delivery Time :3-4 week days
Packaging Details :Vacuum packing in a class 10000 clean room environment,in cassettes of 25pcs or single wafer containers.
Product Name :Sic Epitaxial Wafer
Primary Flat Length :47.5mm ± 1.5mm
Diameter :150.0mm +0mm/-0.2mm
Crystal Form :4H
Polytype :None Permitted
Surface Orientation :Off-Axis:4°toward <11-20>±0.5 °
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JDCD03-001-004 Sic Epitaxial Wafer P-MOS P-SBD D Grade Polytype None Permitted

JDCD03-001-004

Overview

A SiC wafer is a semiconductor material that has excellent electrical and thermal properties. It is a high-performance semiconductor that is ideal for a wide variety of applications. In addition to its high thermal resistance, it also features a very high level of hardness.

Compared to other semiconductors, a silicon carbide wafer is ideal for a wide range of power and voltage applications. This means that it is suitable for a variety of electrical and optical devices.

Property P-MOS Grade P-SBD Grade D Grade
Crystal Form 4H
Polytype None Permitted Area≤5%
(MPD) a ≤0.2 /cm2 ≤0.5 /cm2 ≤5 /cm2
Hex Plates None Permitted Area≤5%
Hexagonal Polycrystal None Permitted
Inclusions a Area≤0.05% Area≤0.05% N/A
Resistivity 0.015Ω•cm—0.025Ω•cm 0.015Ω•cm—0.025Ω•cm 0.014Ω•cm—0.028Ω•cm
(EPD)a ≤4000/cm2 ≤8000/cm2 N/A
(TED)a ≤3000/cm2 ≤6000/cm2 N/A
(BPD)a ≤1000/cm2 ≤2000/cm2 N/A
(TSD)a ≤600/cm2 ≤1000/cm2 N/A
Stacking Fault ≤0.5% Area ≤1% Area N/A

Surface Metal Contamination

(Al, Cr, Fe, Ni, Cu, Zn, Pb, Na, K, Ti, Ca ,V, Mn) ≤1E11 cm-2

Diameter 150.0 mm +0mm/-0.2mm
Surface Orientation Off-Axis:4°toward <11-20>±0.5 °
Primary Flat Length 47.5 mm ± 1.5 mm
Secondary Flat Length No Secondary Flat
Primary Flat Orientation Parallel to<11-20>±1°
Secondary Flat Orientation N/A
Orthogonal Misorientation ±5.0°
Surface Finish C-Face:Optical Polish,Si-Face:CMP
Wafer Edge Beveling

Surface Roughness

(10μm×10μm)

Si Face Ra≤0.20 nm ; C Face Ra≤0.50 nm
Thickness a 350.0μm± 25.0 μm
LTV(10mm×10mm)a ≤2μm ≤3μm
(TTV)a ≤6μm ≤10μm
(BOW) a ≤15μm ≤25μm ≤40μm
(Warp) a ≤25μm ≤40μm ≤60μm
Chips/Indents None Permitted ≥0.5mm Width and Depth Qty.2 ≤1.0 mm Width and Depth

Scratches a

(Si Face,CS8520)

≤5 and Cumulative Length≤0.5×Wafer Diameter

≤5 and Cumulative Length≤1.5×Wafer

Diameter

TUA(2mm*2mm) ≥98% ≥95% N/A
Cracks None Permitted
Contamination None Permitted
Property P-MOS Grade P-SBD Grade D Grade
Edge Exclusion 3mm

Remark: 3mm edge exclusion is used for the items marked with a.

About Us

We specialize in processing a variety of materials into wafers, substrates and customized optical glass parts.components widely used in electronics, optics, opto electronics and many other fields. We also have been working closely with many domestic and oversea universities, research institutions and companies, provide customized products and services for their R&D projects. It's our vision to maintaining a good relationship of cooperation with our all customers by our good reputations.

FAQ

Q: Are you trading company or manufacturer ?
We are factory.
Q: How long is your delivery time?
Generally it is 3-5 days if the goods are in stock.
or it is 7-10 days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra ?
Yes, we could offer the sample for free charge but do not pay the cost of freight.
Q: What is your terms of payment ?
Payment <=5000USD, 100% in advance.
Paymen >=5000USD, 80% T/T in advance , balance before shippment.

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