Shanghai GaNova Electronic Information Co., Ltd.

Semiconductor industry professional one-stop procurement platform, to provide you with superior quality and diversity of products and technical services

Manufacturer from China
Active Member
4 Years
Home / Products / Wafer Dicing Machine / 8 inch Wafer Dicing Machine X Axis Cutting Range 260mm 1.8 KW 2.2 KW /

show pictures

Contact Now
Shanghai GaNova Electronic Information Co., Ltd.
City:shanghai
Province/State:shanghai
Country/Region:china
Contact Person:Xiwen Bai (Ciel)
Contact Now

8 inch Wafer Dicing Machine X Axis Cutting Range 260mm 1.8 KW 2.2 KW

8 inch Wafer Dicing Machine X Axis Cutting Range 260mm 1.8 KW  2.2 KW
  • 8 inch Wafer Dicing Machine X Axis Cutting Range 260mm 1.8 KW  2.2 KW
Products Detailed
DAD3350 Wafer Dicing Machine X-Axis Cutting Range 260mm 1.8 KW, 2.2 KW Process quality By adopting a high-rigidity bridge-type frame and a spindle ...
View Products Detailed →